الرئيسية
الأبحاث العلمية
التدريس
التدرج الوظيفى
السيرة الذاتية
البحث الأكاديمى
إتصل بنا
الموقع الجديد
المجالات البحثية
Lead free solder alloy
Mechanical properties of solder alloy
structure properties of solder alloy
Thermal properties of solder alloy
الفيزياء
الابحاث العلمية
1 -
Influence of Rotating Magnetic Field (RMF) on Dendrite Growth, Mechanical and Elastic Properties of Sn-Cu-Co Lead-Free Solder Alloy (2023).
2 -
Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy (2023).
3 -
Robust effects of In, Fe, and Co additions on microstructures, thermal, and mechanical properties of hypoeutectic Sn–Zn-based lead-free solder alloy (2023).
4 -
The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements (2022).
5 -
Novel low Ag-content Sn–Ag–Cu–Sb–Al solder alloys with enhanced elastic compliance and plastic energy dissipation ability by applying rotating magnetic field (2021).
6 -
Controlling Ag3Sn Plate Formation and Its Effect on the Creep Resistance of Sn–3.0Ag–0.7Cu Lead‑Free Solder by Adding Minor Alloying Elements Fe, Co, Te and Bi (2020).
7 -
Influence of permanent magnet stirring on dendrite morphological and elastic properties of a novel Sn–Ag–Cu–Sb–Al solder alloy by ultrasonic pulse echo method (2020).
8 -
Viscoplastic characterization of novel (Fe,Co,Te)/Bi containing Sn–3.0Ag–0.7Cu lead‑free solder alloy (2020).
9 -
Novel symbol-like IMC formation and changes in the electrical, thermal and mechanical properties of Bi doped Sn–2.0Ag–0.7Cu solders (2017).
10 -
Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly (2014).
11 -
Novel Bi-containing Sn–1.5Ag–0.7Cu lead-free solder alloy with further enhanced thermal property and strength for mobile products (2014).
12 -
Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni (2014).
13 -
Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder (2013).
14 -
Enhanced ductility and mechanical strength of Ni-doped Sn–3.0Ag–0.5Cu lead-free solders (2013).
15 -
Evolution of thermal property and creep resistance of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solders (2013).
16 -
Improved strength of Ni and Zn-doped Sn–2.0Ag–0.5Cu lead-free solder alloys under controlled processing parameters (2013).
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Zagazig University
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